Reflow Oven Reflow Soldering Machine

1.After use, don't switch off the power instantly. Make sure the machine is cooling down sufficiently before switching off.
2.Make sure to place the machine in a very well ventilated area.

3. Please allow 1-2cm errors due to manual measurement.

4.Due to the difference between different monitors, the pictures may not reflect the actual color of the item.

5. For safety reasons, must be connected to a reliable safety grounding device must have three feet with ground connection.

6. Non-professionals are not allowed to disassemble the back cover of the machine at will.

7. This T962C needs to be wired separately.

Features    

• This is a micro-processor controlled reflow oven, works automatically by micro-computer control. It can satisfy a dissimilarity SMD, BAG soldering a request on a PCB assembly.

•  T962C may be used to automatically “re-flow” solder to correct bad solder joints, remove/replace bad components and complete small engineering models or prototypes.

• Soldering Area
  　

• Infrared reflow oven model: T962C;

• Rated power: 2500W.

• Effective soldering max area: 600 x 400 mm (15.7 x 23.6 inch), large welding area for high efficiency.

• Thermal cycle accuracy is maintained by closed loop micro-computer control with infrared heaters, thermocouple and circulating air.

• User interface is implemented by way of T962C input keys and an LCD display.

• The machine is preset with 8 intelligent temperature control curves. The curve display operation is more intuitive than the digital display, and the operation status is monitored in real time.

• The machine is equipped with 2 vent pipe pre-installed interface, and the smoke exhaust pipe can be installed on the back of the machine.

Reflow oven model: T962C
Rated power: 2500W
Effective Soldering max area: 600 x 400 mm (15.7 x 23.6 inch)
Power supply: AC110V/ 60Hz
Temperature Range: 0 - 280℃
Cycle Time: 1～9 min

Size: 675 x 510 x 240 mm ( 26.5 x 20 x 9.5 in )
Rated Duty Cycle: 100%